Invention Grant
- Patent Title: Spatial composites
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Application No.: US15716086Application Date: 2017-09-26
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Publication No.: US11678445B2Publication Date: 2023-06-13
- Inventor: Christopher D. Prest , Stephen B. Lynch , Teodor Dabov
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: H05K5/02
- IPC: H05K5/02 ; B29C33/38 ; B29C35/02 ; B22D19/14 ; B29C70/72 ; B29C45/14 ; B22D19/04 ; H04M1/02 ; H05K5/04 ; H05K5/00 ; B29L31/34 ; B29K105/16 ; B29C35/08

Abstract:
A housing of an electronic device includes a substrate defining an external surface and internal surface of the housing, at least one sidewall extending from the substrate, and abrasion-resistant members at least partly embedded in the substrate and extending beyond the external surface. The abrasion-resistant members may be formed from metal or ceramic. The substrate comprises a moldable matrix. The abrasion-resistant members are harder than the moldable matrix.
Public/Granted literature
- US20180213660A1 SPATIAL COMPOSITES Public/Granted day:2018-07-26
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