Invention Grant
- Patent Title: Vacuum encapsulated Josephson junction
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Application No.: US17037109Application Date: 2020-09-29
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Publication No.: US11678591B2Publication Date: 2023-06-13
- Inventor: Isaac Lauer , Karthik Balakrishnan , Jeffrey Sleight , David James Frank
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agent Erik Johnson
- Main IPC: H01L39/04
- IPC: H01L39/04 ; H01L39/02 ; G06N10/00 ; H01L39/24 ; H01L39/22

Abstract:
Devices, systems, methods, and/or computer-implemented methods that can facilitate a qubit device comprising a vacuum encapsulated Josephson junction are provided. According to an embodiment, a device can comprise a substrate having an encapsulated vacuum cavity provided on the substrate. The device can further comprise one or more superconducting components of a superconducting circuit provided inside the encapsulated vacuum cavity.
Public/Granted literature
- US20220102612A1 VACUUM ENCAPSULATED JOSEPHSON JUNCTION Public/Granted day:2022-03-31
Information query
IPC分类: