Invention Grant
- Patent Title: Multiple supply and return connections for liquid cooling loop assemblies
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Application No.: US17157373Application Date: 2021-01-25
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Publication No.: US11683913B2Publication Date: 2023-06-20
- Inventor: Feini Zhang , Madhusudan K. Iyengar , Reza H. Khiabani
- Applicant: Google LLC
- Applicant Address: US CA Mountain View
- Assignee: Google LLC
- Current Assignee: Google LLC
- Current Assignee Address: US CA Mountain View
- Agency: Lerner David LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A system includes a central supply line and a central return line connected to a fluid source of cooling liquid. A rack supply manifold is connected to the central supply line. A rack return manifold is connected to the central return line. A liquid cooling loop assembly may be coupled to at least one cooling device connected to a circuit board. Multiple inlet connectors may be connected to the rack supply manifold. Multiple outlet connectors may be connected to the rack return manifold. The multiple inlet connectors provide a passageway for the cooling liquid from the central supply line into the liquid cooling loop assembly for distribution to the at least one cooling device. The multiple outlet connectors provide a passageway to the rack return manifold for the cooling liquid exiting the at least one cooling device.
Public/Granted literature
- US20220240421A1 MULTIPLE SUPPLY AND RETURN CONNECTIONS FOR LIQUID COOLING LOOP ASSEMBLIES Public/Granted day:2022-07-28
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