Invention Grant
- Patent Title: Methods and systems for analysis of wafer scan data
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Application No.: US17160364Application Date: 2021-01-27
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Publication No.: US11688055B2Publication Date: 2023-06-27
- Inventor: Guy Shwartz , Ido Almog
- Applicant: Applied Materials Israel Ltd.
- Applicant Address: IL Rehovot
- Assignee: Applied Materials Israel Ltd.
- Current Assignee: Applied Materials Israel Ltd.
- Current Assignee Address: IL Rehovot
- Agency: Lowenstein Sandler LLP
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06T7/00

Abstract:
Disclosed is a computerized method for detecting defects on a sample. The method includes: (i) receiving scan data corresponding to a pixel on the sample; (ii) computing a difference vector d based on the scan data and corresponding reference data; (iii) computing a parameter D dependent on t=Γd−(Glinear/∥Γs∥2)Γs, wherein ΓTΓ=K−1 with K being a covariance matrix corresponding to the pixel, s is a predetermined kernel characterizing a defect signal, and Glinear=s·(K−1 d) is a gaussian approximation of a likelihood ratio test expression for distinguishing the defect signal from noise, and wherein D substantially monotonically increases with ∥t∥; and (iv) computing a score q(g, D) indicative of whether the pixel is defective, wherein g is a parameter indicative of a value of Glinear and q(g, D) substantially monotonically increases with g and substantially monotonically decreases with D.
Public/Granted literature
- US20220237758A1 METHODS AND SYSTEMS FOR ANALYSIS OF WAFER SCAN DATA Public/Granted day:2022-07-28
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