The invention provides a fingerprint recognition module comprising a first dielectric layer, a processing unit, a plurality of first sensing series and a plurality of second sensing series. A first side and a second side of the first dielectric layer are provided with first metal contacts and second metal contacts respectively. The processing unit, disposed on the first side, has first conductive pads for electrically connecting the first metal contacts, coupled with the second metal contacts. The first sensing series, coupled with the first traces, are arranged between the first dielectric layer and a second dielectric layer. The second sensing series, coupled with the second traces, are arranged between the second dielectric layer and a third dielectric layer. The first trace is coupled with a third trace through a first conductive pillar, and the second traces and the third traces are coupled with the second metal contacts.