Invention Grant
- Patent Title: Coil component
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Application No.: US16911128Application Date: 2020-06-24
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Publication No.: US11688546B2Publication Date: 2023-06-27
- Inventor: Kwi Jong Lee , Jung Min Kim , Young Seuck Yoo , Sung Jin Huh , Jin Hyuck Yang , Tae Hyun Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190173853 2019.12.24
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/32 ; H01F17/04 ; H01F17/00

Abstract:
A coil component includes a support substrate and a coil portion disposed on the support substrate, a body in which the support substrate and the coil portion are embedded, first and second lead portions extending from the coil portion and respectively exposed to a surface of the body, a surface insulating layer disposed on the surface of the body and having openings respectively exposing the first and second lead portions, and first and second external electrodes disposed on the surface insulating layer and connected to the first and second lead portions exposed through the openings. Each of the first and second external electrodes includes a first metal layer formed of a metal and in direct contact with the first and second lead portions.
Public/Granted literature
- US20210193373A1 COIL COMPONENT Public/Granted day:2021-06-24
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