Invention Grant
- Patent Title: Integrated thin film capacitors on a glass core substrate
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Application No.: US16030196Application Date: 2018-07-09
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Publication No.: US11688729B2Publication Date: 2023-06-27
- Inventor: Adel Elsherbini , Krishna Bharath , Mathew Manusharow
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP
- Main IPC: H01L27/01
- IPC: H01L27/01 ; H01L23/498 ; H01L49/02

Abstract:
An apparatus is provided which comprises: one or more first conductive contacts on a first substrate surface, one or more second conductive contacts on a second substrate surface opposite the first substrate surface, a core layer comprising glass between the first and the second substrate surfaces, and one or more thin film capacitors on the glass core conductively coupled with one of the first conductive contacts and one of the second conductive contacts, wherein the thin film capacitor comprises a first metal layer on a surface of the glass core, a thin film dielectric material on a surface of the first metal layer, and a second metal layer on a surface of the thin film dielectric material. Other embodiments are also disclosed and claimed.
Public/Granted literature
- US20200013770A1 INTEGRATED THIN FILM CAPACITORS ON A GLASS CORE SUBSTRATE Public/Granted day:2020-01-09
Information query
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