Invention Grant
- Patent Title: Memory devices including heaters
-
Application No.: US17866903Application Date: 2022-07-18
-
Publication No.: US11694727B2Publication Date: 2023-07-04
- Inventor: Tomoko Ogura Iwasaki , Foroozan Koushan , Jayasree Nayar , Ji-Hye Gale Shin
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: G11C5/02
- IPC: G11C5/02 ; H10B41/35 ; H10B41/41 ; H10B43/35

Abstract:
Memory devices might include an array of memory cells, a plurality of access lines, and a heater. The array of memory cells might include a plurality of strings of series-connected memory cells. Each access line of the plurality of access lines might be connected to a control gate of a respective memory cell of each string of series-connected memory cells of the plurality of strings of series-connected memory cells. The heater might be adjacent to an end of each access line of the plurality of access lines.
Public/Granted literature
- US20220351755A1 MEMORY DEVICES INCLUDING HEATERS Public/Granted day:2022-11-03
Information query