Invention Grant
- Patent Title: Apparatus and method for delivering a plurality of waveform signals during plasma processing
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Application No.: US17884423Application Date: 2022-08-09
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Publication No.: US11694876B2Publication Date: 2023-07-04
- Inventor: James Rogers , Katsumasa Kawasaki
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01J37/32

Abstract:
Embodiments of the present disclosure generally relate to a system used in a semiconductor device manufacturing process. More specifically, embodiments provided herein generally include apparatus and methods for synchronizing and controlling the delivery of an RF bias voltage signal and a pulsed voltage waveform to one or more electrodes within a plasma processing chamber. Embodiments of the disclosure include a method and apparatus for synchronizing a pulsed radio frequency (RF) waveform to a pulsed voltage (PV) waveform, such that the pulsed RF waveform is on during a first stage of the PV waveform and off during a second stage. The first stage of the PV waveform includes a sheath collapse stage. The second stage of the PV waveform includes an ion current stage.
Public/Granted literature
- US20230178336A1 APPARATUS AND METHOD FOR DELIVERING A PLURALITY OF WAVEFORM SIGNALS DURING PLASMA PROCESSING Public/Granted day:2023-06-08
Information query
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