- Patent Title: High electron mobility transistor and method for forming the same
-
Application No.: US17029075Application Date: 2020-09-23
-
Publication No.: US11695049B2Publication Date: 2023-07-04
- Inventor: Chih-Tung Yeh , Chun-Liang Hou , Wen-Jung Liao , Chun-Ming Chang , Yi-Shan Hsu , Ruey-Chyr Lee
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN 2010799660.6 2020.08.11
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/778 ; H01L29/66 ; H01L29/06 ; H01L29/40 ; H01L29/205 ; H01L29/20

Abstract:
A high electron mobility transistor (HEMT) and method for forming the same are disclosed. The high electron mobility transistor includes a substrate, a mesa structure disposed on the substrate, a passivation layer disposed on the mesa structure, and at least a contact structure disposed in the passivation and the mesa structure. The mesa structure includes a channel layer and a barrier layer disposed on the channel layer. The contact structure includes a body portion and a plurality of protruding portions. The body portion is through the passivation layer. The protruding portions connect to a bottom surface of the body portion and through the barrier layer and a portion of the channel layer.
Information query
IPC分类: