- 专利标题： Soldering device and control method for soldering device
-
申请号： US16904918申请日： 2020-06-18
-
公开(公告)号： US11697169B2公开(公告)日： 2023-07-11
- 发明人: Hisaki Hayashi , Yasuyuki Watanabe , Noboru Hashimoto
- 申请人： DENSO TEN Limited , Senju System Technology Co., Ltd.
- 申请人地址： JP Kobe
- 专利权人： DENSO TEN Limited,SENJU SYSTEM TECHNOLOGY CO., LTD.
- 当前专利权人： DENSO TEN Limited,SENJU SYSTEM TECHNOLOGY CO., LTD.
- 当前专利权人地址： JP Kobe; JP Toyama
- 代理机构： Oliff PLC
- 优先权： JP 19113901 2019.06.19
- 主分类号： B23K3/06
- IPC分类号： B23K3/06 ; B23K3/08 ; G05B15/02
摘要：
A soldering device according to an embodiment includes a jet nozzle and a cover. The jet nozzle jets a molten solder. The cover is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle. The cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside thereof for a waiting time period other than the application time period.
信息查询
IPC分类:
