- 专利标题： Systems and methods for overmolding a card to prevent chip fraud
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申请号： US17675316申请日： 2022-02-18
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公开(公告)号： US11699058B2公开(公告)日： 2023-07-11
- 发明人: Daniel Herrington , Stephen Schneider , Tyler Maiman
- 申请人： Capital One Services, LLC
- 申请人地址： US VA McLean
- 专利权人： CAPITAL ONE SERVICES, LLC
- 当前专利权人： CAPITAL ONE SERVICES, LLC
- 当前专利权人地址： US VA McLean
- 代理机构： Hunton Andrews Kurth LLP
- 主分类号： G06K19/073
- IPC分类号： G06K19/073 ; G06Q20/34 ; H01L23/00
摘要：
Systems and methods for overmolding a card are provided. A chip fraud prevention system include a device including a chip and a substrate. The chip may be at least partially encompassed in a chip pocket, and the substrate may be at least partially encompassed by the overmold.
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