- Patent Title: Foldable electronic device including flexible printed circuit board
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Application No.: US17716009Application Date: 2022-04-08
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Publication No.: US11700693B2Publication Date: 2023-07-11
- Inventor: Jeong Woo , Jungchul An , Seungki Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Cha & Reiter, LLC
- Priority: KR 20190019515 2019.02.19
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H01R12/79 ; H01R12/77 ; H05K5/02 ; H05K5/00 ; H05K1/11 ; H05K1/02

Abstract:
According to an embodiment, it is possible to provide an electronic device including: a housing; a first printed circuit board disposed in the housing; a second printed circuit board disposed in the housing and spaced apart from the first printed circuit board; a first flexible printed circuit board electrically connecting the first printed circuit board and the second printed circuit board; and a second flexible printed circuit board electrically connecting the first printed circuit board and the second printed circuit board, in which the second flexible printed circuit board may be longer than the first flexible printed circuit board. Other embodiments are also disclosed.
Public/Granted literature
- US20220232704A1 FOLDABLE ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD Public/Granted day:2022-07-21
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