Invention Grant
- Patent Title: Method for manufacturing ring-shaped glass spacer
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Application No.: US17589824Application Date: 2022-01-31
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Publication No.: US11705158B2Publication Date: 2023-07-18
- Inventor: Masao Takano , Shinji Eda
- Applicant: HOYA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP 17191256 2017.09.29
- Main IPC: G11B17/02
- IPC: G11B17/02 ; G11B17/038

Abstract:
A method for manufacturing the ring-shaped glass spacer to be arranged in contact with a magnetic disk in a hard disk drive apparatus, including: preparing a ring-shaped glass blank; and grinding main surfaces of the ring-shaped glass blank by using grinding pads that include diamond particles as fixed abrasive particles.
Public/Granted literature
- US20220157340A1 METHOD FOR MANUFACTURING RING-SHAPED GLASS SPACER Public/Granted day:2022-05-19
Information query
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