Invention Grant
- Patent Title: Coil component
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Application No.: US16567520Application Date: 2019-09-11
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Publication No.: US11705268B2Publication Date: 2023-07-18
- Inventor: Seung Ho Han , Sung Sik Shin , Jae Wook Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190025074 2019.03.05
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/29 ; H01F41/04 ; H01F41/12 ; H01F27/32

Abstract:
A coil component is provided. The coil component includes a body having one surface and the other surface, opposing each other, and a wall surface connecting the one surface and the other surface, a coil portion embedded in the body and having an end exposed to the wall surface of the body, an external electrode including a connecting portion disposed on the wall surface of the body and connected to the end of the coil portion, and an extension extending from the connecting portion onto the one surface of the body, a first insulating layer covering the other surface of the body, and an identification portion passing through the first insulating layer and including the same material as a material of the external electrode.
Public/Granted literature
- US20200286674A1 COIL COMPONENT Public/Granted day:2020-09-10
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