Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17459376Application Date: 2021-08-27
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Publication No.: US11705434B2Publication Date: 2023-07-18
- Inventor: Masayuki Miura , Yuichi Sano , Kazuma Hasegawa
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: KIOXIA CORPORATION
- Current Assignee: KIOXIA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP 21035711 2021.03.05
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/498 ; H01L25/00

Abstract:
A semiconductor device includes a first stacked body including first semiconductor chips stacked in a first direction and offset relative to each other in a second direction; a first columnar electrode coupled to the first semiconductor chip and extending in the first direction; a second stacked body arranged relative to the first stacked body in the second direction and including second semiconductor chips stacked in the first direction and offset relative to each other in the second direction; a second columnar electrode coupled to the second semiconductor chip and extending in the first direction; and a third semiconductor chip arranged substantially equally spaced to the first columnar electrode and the second columnar electrode.
Public/Granted literature
- US20220285319A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-09-08
Information query
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