Invention Grant
- Patent Title: Apparatus for surface mount connectors
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Application No.: US16949372Application Date: 2020-10-27
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Publication No.: US11705652B2Publication Date: 2023-07-18
- Inventor: Jian Miremadi , David A. Moore , John Norton , Eduardo F. Velazquez
- Applicant: Hewlett Packard Enterprise Development LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Spring
- Agency: Nolte Intellectual Property Law Group
- The original application number of the division: US16400540 2019.05.01
- Main IPC: H01R12/70
- IPC: H01R12/70 ; H05K1/18 ; H01R13/11 ; H01R12/71

Abstract:
Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.
Public/Granted literature
- US20210044039A1 APPARATUS FOR SURFACE MOUNT CONNECTORS Public/Granted day:2021-02-11
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