Invention Grant
- Patent Title: Hybrid sensor system and method for providing 3D imaging
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Application No.: US17578232Application Date: 2022-01-18
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Publication No.: US11706400B2Publication Date: 2023-07-18
- Inventor: Kwang Oh Kim , Yibing Michelle Wang , Radwanul Hasan Siddique , Lilong Shi , Chunji Wang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Main IPC: H04N13/25
- IPC: H04N13/25 ; G06T7/55 ; G06T7/521 ; H04N13/156 ; H04N13/254 ; G01S17/894 ; G06T7/20 ; G06V20/64 ; H04N25/79 ; H04N25/705 ; G03B35/08 ; G03B35/10 ; G05D1/00 ; G05D1/02

Abstract:
Provided is a 3D depth sensing system and method of providing an image based on a hybrid sensing array. The 3D sensing system including a light source configured to emit light, a hybrid sensing array comprising a 2D sensing region configured to detect ambient light reflected from an object and a 3D depth sensing region configured to detect the light emitted by the light source and reflected from the object, a metalens on the hybrid sensing array, the metalens being configured to direct the ambient light reflected from the object towards the 2D sensing region, and to direct the light emitted by the light source and reflected from the object towards the 3D depth sensing region, and a processing circuit configured to combine 2D image information provided by the 2D sensing region and 3D information provided by the 3D depth sensing region to generate a combined 3D image.
Public/Granted literature
- US20220137226A1 HYBRID SENSOR SYSTEM AND METHOD FOR PROVIDING 3D IMAGING Public/Granted day:2022-05-05
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