Invention Grant
- Patent Title: Electronics enclosure with heat-transfer element
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Application No.: US17643991Application Date: 2021-12-13
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Publication No.: US11706899B2Publication Date: 2023-07-18
- Inventor: Nikhil R. Lakhkar , Kevin J. Gehret , Russ M. Beisner
- Applicant: Emerson Climate Technologies, Inc.
- Applicant Address: US OH Sidney
- Assignee: Emerson Climate Technologies, Inc.
- Current Assignee: Emerson Climate Technologies, Inc.
- Current Assignee Address: US OH Sidney
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F04B39/06

Abstract:
A compressor may include a compressor shell, a motor, a compression mechanism, an enclosure, a control module, a fan, and an airflow deflector. The compression mechanism is disposed within the compressor shell. The motor drives the compression mechanism. The enclosure defines an internal cavity. The control module is in communication with the motor and is configured to control operation of the motor. The fan may be disposed within the internal cavity. The airflow deflector may include a base portion, a first leg, and a second leg. The first and second legs may be spaced apart from each other and may extend from the base portion. The fan may force air against the base portion. A first portion of the air may flow from the base portion along the first leg, and a second portion of the air may flow from the base portion along the second leg.
Public/Granted literature
- US20220104391A1 Electronics Enclosure with Heat-Transfer Element Public/Granted day:2022-03-31
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