Invention Grant
- Patent Title: Integrated assemblies comprising memory cells and shielding material between the memory cells
-
Application No.: US17083174Application Date: 2020-10-28
-
Publication No.: US11706909B2Publication Date: 2023-07-18
- Inventor: Sanh D. Tang , Mitsunari Sukekawa , Yusuke Yamamoto , Christopher J. Kawamura , Hiroaki Taketani
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- The original application number of the division: US16354450 2019.03.15
- Main IPC: H10B12/00
- IPC: H10B12/00 ; H01L23/528

Abstract:
Some embodiments include a memory device having a buried wordline, a shield plate, and an access device. The access device includes first and second diffusion regions and a channel region. The diffusion regions and the channel region are arranged vertically so that the channel region is between the first and second diffusion regions. The wordline is adjacent to a first side surface of the channel region, and the shield plate is adjacent to a second side surface of the channel region; with the first and second side surfaces being in opposing relation to one another. Some embodiments include methods of forming integrated assemblies.
Public/Granted literature
Information query