Invention Grant
- Patent Title: Light emitting diode module
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Application No.: US16863069Application Date: 2020-04-30
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Publication No.: US11710813B2Publication Date: 2023-07-25
- Inventor: Changjoon Lee , Seongho Son , Jongsung Lee , Youngki Jung
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR 20190052516 2019.05.03 KR 20190097215 2019.08.09 KR 20200046933 2020.04.17
- Main IPC: H01L33/62
- IPC: H01L33/62 ; G02B1/14 ; H01L25/075 ; G09F9/302 ; G09G3/32

Abstract:
A light emitting diode (LED) module includes an integrated substrate, the integrated substrate including a plurality of LEDs; a glass substrate; and a signal wiring layer provided on the glass substrate. The signal wiring layer includes a plurality of signal electrodes configured to supply a data signal to the plurality of LEDs. The LED module further includes a conductive pattern provided on at least one surface of the integrated substrate, and connected to a ground.
Public/Granted literature
- US20200350476A1 LIGHT EMITTING DIODE MODULE Public/Granted day:2020-11-05
Information query
IPC分类: