Invention Grant
- Patent Title: Electric field shaping apparatus and target processing device using electric field
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Application No.: US17183929Application Date: 2021-02-24
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Publication No.: US11715581B2Publication Date: 2023-08-01
- Inventor: Heon Jin Choi , Jae Suk Sung
- Applicant: UIF (University industry Foundation), Yonsei University
- Applicant Address: KR Seoul
- Assignee: UIF (UNIVERSITY INDUSTRY FOUNDATION), YONSEI UNIVERSITY
- Current Assignee: UIF (UNIVERSITY INDUSTRY FOUNDATION), YONSEI UNIVERSITY
- Current Assignee Address: KR Seoul
- Agency: Tarolli, Sundheim, Covell & Tummino L.L.P
- Priority: KR 20200022825 2020.02.25
- Main IPC: H01B7/02
- IPC: H01B7/02 ; A61N1/04

Abstract:
An electric field shaping apparatus according to a present embodiment includes a substrate, a first electrode positioned on the substrate, a second electrode spaced apart from the first electrode, a power source configured to provide a voltage between the first electrode and the second electrode, and an insulating material with which the first electrode is coated, wherein one or more holes configured to shape an electric field generated between the first electrode and the second electrode are formed in the insulating material.
Public/Granted literature
- US20220270781A1 ELECTRIC FIELD SHAPING APPARATUS AND TARGET PROCESSING DEVICE USING ELECTRIC FIELD Public/Granted day:2022-08-25
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