Invention Grant
- Patent Title: Semiconductor device
-
Application No.: US17399907Application Date: 2021-08-11
-
Publication No.: US11715788B2Publication Date: 2023-08-01
- Inventor: Kenji Sasaki
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP 20157314 2020.09.18
- Main IPC: H01L29/737
- IPC: H01L29/737 ; H01L23/00 ; H01L29/205 ; H01L29/08

Abstract:
At least one transistor is arranged on a substrate. A collector layer and a base layer of the transistor compose a collector mesa having a substantially mesa shape and the collector mesa has side faces tilting with respect to the substrate so that the dimension of a top face in a first direction of a plane of the substrate is smaller than the dimension of a bottom face therein. A first insulating film covering the transistor is arranged on the substrate. A first-layer emitter line that extends from an area overlapped with the top face of the collector mesa to areas overlapped with at least part of the tilting side faces of the collector mesa in a plan view is arranged on the first insulating film. A second-layer emitter line and an emitter bump are arranged on the first-layer emitter line.
Public/Granted literature
- US20220093775A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-03-24
Information query
IPC分类: