Invention Grant
- Patent Title: Method for fabricating a solar module of rear contact solar cells using linear ribbon-type connector strips and respective solar module
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Application No.: US17471294Application Date: 2021-09-10
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Publication No.: US11715806B2Publication Date: 2023-08-01
- Inventor: Philipp Johannes Rostan , Robert Wade , Noel G. Diesta , Shankar Gauri Sridhara , Anders Soreng
- Applicant: REC SOLAR PTE. LTD.
- Applicant Address: SG Singapore
- Assignee: REC SOLAR PTE. LTD.
- Current Assignee: REC SOLAR PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: Lee & Hayes, P.C.
- Priority: GB 16209 2012.09.11
- The original application number of the division: US14422131
- Main IPC: H01L31/05
- IPC: H01L31/05 ; H01L31/0224 ; H01L31/068 ; H01L31/02

Abstract:
A solar module and a method for fabricating a solar module comprising a plurality of rear contact solar cells are described. Rear contact solar cells (1) are provided with a large size of e.g. 156×156 mm2. Soldering pad arrangements (13, 15) applied on emitter contacts (5) and base contacts (7) are provided with one or more soldering pads (9, 11) arranged linearly. The soldering pad arrangements (13, 15) are arranged asymmetrically with respect to a longitudinal axis (17). Each solar cell (1) is then separated into first and second cell portions (19, 21) along a line (23) perpendicular to the longitudinal axis (17). Due to such cell separation and the asymmetrical design of the soldering pad arrangements (13, 15), the first and second cell portions (19, 21) may then be arranged alternately along a line with each second cell portion (21) arranged in a 180°-orientation with respect to the first cell portions (19) and such that emitter soldering pad arrangements (13) of a first cell portion (19) are aligned with base soldering pad arrangements (15) of neighboring second cell portions (21), and vice versa. Simple linear ribbon-type connector strips (25) may be used for interconnecting the cell portions (19, 21) by soldering onto the underlying aligned emitter and base soldering pad arrangements (13, 15). The interconnection approach enables using standard ribbon-type connector strips (25) while reducing any bow as well as reducing series resistance losses.
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