The present disclosure relates to an electronic element module including a printed circuit board including a first insulating layer having a plurality of first openings, and a build-up structure disposed on one surface of the first insulating layer and having a first through-portion, wherein the plurality of first openings are disposed in the first through-portion on a plane; a conductive adhesive disposed in at least a portion of each of the plurality of first openings; and a first electronic element disposed in the first through-portion, and having a plurality of first electrode pads disposed. At least a portion of each of the plurality of first electrode pads is disposed in the plurality of first openings.