• 专利标题: LED chip insert, lighting device, lighting module, and method of manufacturing the lighting device
  • 申请号: US17759348
    申请日: 2021-01-20
  • 公开(公告)号: US11716815B2
    公开(公告)日: 2023-08-01
  • 发明人: Michael BeckSebastian JoossGerhard Behr
  • 申请人: OSRAM GmbH
  • 申请人地址: DE Munich
  • 专利权人: OSRAM GmbH
  • 当前专利权人: OSRAM GmbH
  • 当前专利权人地址: DE Munich
  • 代理机构: Slater Matsil, LLP
  • 优先权: DE 2020200880.9 2020.01.24
  • 国际申请: PCT/EP2021/051225 2021.01.20
  • 国际公布: WO2021/148484A 2021.07.29
  • 进入国家日期: 2022-07-22
  • 主分类号: H05K1/00
  • IPC分类号: H05K1/00 H05K1/18
LED chip insert, lighting device, lighting module, and method of manufacturing the lighting device
摘要:
In an embodiment a LED chip insert for a printed circuit board includes a lead frame in which a number of electrically conductive strings with respective ends are formed by punching, the strings having support surfaces which are configured for mounting on the printed circuit board and which form a common plane, wherein the lead frame has a region formed as a recess with respect to the ends, an injection molded frame including an electrically insulating material and annularly surrounding a surface of the lead frame exposed within the region formed as the recess facing the ends of the strings, and thereby effecting an overall trough-like structure; and at least one LED chip which is placed in the region formed as the recess and has a first electrical contact terminal and a second electrical contact terminal, the first electrical contact terminal being electrically conductively connected to a first one of the strings and the second electrical contact terminal being electrically conductively connected to a second one of the strings.
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