发明授权
- 专利标题: Power module
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申请号: US17203938申请日: 2021-03-17
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公开(公告)号: US11721670B2公开(公告)日: 2023-08-08
- 发明人: Takashi Tsubakidani , Kosuke Yamaguchi
- 申请人: Mitsubishi Electric Corporation
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Electric Corporation
- 当前专利权人: Mitsubishi Electric Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Studebaker & Brackett PC
- 优先权: JP 20096847 2020.06.03
- 主分类号: H01L25/065
- IPC分类号: H01L25/065 ; H03K17/687 ; H01L25/18 ; H03K17/0812 ; H01L23/00
摘要:
A second semiconductor switching element is connected in series with a first semiconductor switching element, and is at least partially stacked on the first semiconductor switching element in the thickness direction. A first control element controls the first semiconductor switching element and the second semiconductor switching element, and performs an overcurrent protection operation with reference to a shunt voltage. The first control element is arranged outside the first semiconductor switching element and the second semiconductor switching element in the in-plane direction.
公开/授权文献
- US20210384163A1 POWER MODULE 公开/授权日:2021-12-09
信息查询
IPC分类: