Invention Grant
- Patent Title: Front-end modules with ground plane slots
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Application No.: US17748835Application Date: 2022-05-19
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Publication No.: US11721899B2Publication Date: 2023-08-08
- Inventor: Chin-Hung Ma , Chien-Pai Lai , Chih Hung Chien
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: H01Q21/00
- IPC: H01Q21/00 ; H01Q5/40 ; H01Q1/22 ; H01Q1/24 ; H01Q1/48 ; H01Q13/10 ; H01Q21/06

Abstract:
An example radio frequency (RF) front-end module is described, which may include a printed circuit board (PCB) including a ground plane, an RF integrated circuit (RFIC) including RF components mounted on the PCB, and an antenna array on the PCB. The antenna array may operate at a first resonant frequency in a wireless communication network. Further, the RF front-end module may include a slot defined in the ground plane to provide a second resonant frequency in the wireless communication network. The second resonant frequency is lower than the first resonant frequency.
Public/Granted literature
- US20220278454A1 FRONT-END MODULES WITH GROUND PLANE SLOTS Public/Granted day:2022-09-01
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