Invention Grant
- Patent Title: Method for manufacturing a semiconductor device
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Application No.: US17694994Application Date: 2022-03-15
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Publication No.: US11728388B2Publication Date: 2023-08-15
- Inventor: Keunhwi Cho , Byounghak Hong , Myunggil Kang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR 20190140410 2019.11.05
- Main IPC: H01L29/161
- IPC: H01L29/161 ; H01L29/10 ; H01L29/78

Abstract:
A semiconductor device including an active structure on a substrate, the active structure including silicon germanium patterns and silicon patterns alternately and repeatedly stacked in a vertical direction perpendicular to an upper surface of the substrate; a semiconductor layer on sidewalls of the active structure that face in a first direction parallel to the upper surface of the substrate, the semiconductor layer being a source/drain region; and a gate structure on a surface of the active structure and the substrate, the gate structure extending in a second direction that is perpendicular to the first direction, wherein the silicon germanium patterns are silicon rich-silicon germanium.
Public/Granted literature
- US20220208970A1 METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2022-06-30
Information query
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