Invention Grant
- Patent Title: Insert molding method and insert molding component
-
Application No.: US17951219Application Date: 2022-09-23
-
Publication No.: US11731329B2Publication Date: 2023-08-22
- Inventor: Takanori Ishihama , Toshiya Kuno
- Applicant: CASIO COMPUTER CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JP 17194990 2017.10.05
- The original application number of the division: US16150817 2018.10.03
- Main IPC: B29C45/16
- IPC: B29C45/16 ; B29C45/14 ; B29C45/00 ; B65D1/40 ; B29L31/34

Abstract:
An insert molding component includes a primary molding section having a concave portion formed in one surface thereof, the concave portion including stepped lower and upper concave portions, an insert component disposed on a bottom surface of the lower concave portion, a heat-insulating component disposed in the upper concave portion above an opening of the lower concave portion in which the insert component is disposed, and a secondary molding section disposed in contact with the one surface of the primary molding section.
Public/Granted literature
- US20230015382A1 INSERT MOLDING METHOD AND INSERT MOLDING COMPONENT Public/Granted day:2023-01-19
Information query