发明授权
- 专利标题: Multilayer capacitor, board for mounting the same, and method of manufacturing the same
-
申请号: US17331006申请日: 2021-05-26
-
公开(公告)号: US11735365B2公开(公告)日: 2023-08-22
- 发明人: Dongwoo Kang
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR 20200136814 2020.10.21
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; H01G2/06 ; H01G4/12 ; H01G4/012
摘要:
Provided are a multilayer capacitor and a board for mounting the same. The multilayer capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes and a pair of external electrodes respectively including a conductive layer disposed on opposing ends of the capacitor, a conductive resin layer covering the conductive layer, and a reduced graphene oxide (RGO) layer disposed between the conductive layer and the conductive resin layer.
公开/授权文献
信息查询