- 专利标题: Method for forming epitaxial source/drain features using a self-aligned mask and semiconductor devices fabricated thereof
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申请号: US17187283申请日: 2021-02-26
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公开(公告)号: US11735483B2公开(公告)日: 2023-08-22
- 发明人: Yao-Sheng Huang , I-Ming Chang , Huang-Lin Chao
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: NZ Carr Law Office
- 主分类号: H01L21/8238
- IPC分类号: H01L21/8238 ; H01L29/423 ; H01L21/02 ; H01L29/161 ; H01L29/66 ; H01L29/06 ; H01L29/24 ; H01L29/417 ; H01L29/786 ; H01L27/092
摘要:
Embodiments of the present disclosure provide a method of forming N-type and P-type source/drain features using one patterned mask and one self-aligned mask to increase windows of error tolerance and provide flexibilities for source/drain features of various shapes and/or volumes. In some embodiments, after forming a first type of source/drain features, a self-aligned mask layer is formed over the first type of source/drain features without using photolithography process, thus, avoid damaging the first type of source/drain features in the patterning process.
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