Invention Grant
- Patent Title: Camera module
-
Application No.: US17213836Application Date: 2021-03-26
-
Publication No.: US11736785B2Publication Date: 2023-08-22
- Inventor: Ming-Hsun Lee
- Applicant: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
- Applicant Address: CN Shenzhen
- Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
- Current Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
- Current Assignee Address: CN Shenzhen
- Agency: ScienBiziP, P.C.
- Priority: CN 2110064272.8 2021.01.18
- Main IPC: G03B17/00
- IPC: G03B17/00 ; H04N23/50 ; G03B17/02 ; H05K3/32 ; H05K1/11
Abstract:
A camera module includes a circuit board, a bracket arranged on the circuit board, and at least one electronic component embedded in the bracket and/or arranged on an inner side wall of the bracket. The electronic component is electrically coupled to the circuit board.
Public/Granted literature
- US20220232147A1 CAMERA MODULE Public/Granted day:2022-07-21
Information query
