Invention Grant
- Patent Title: Three-dimensional printing
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Application No.: US16756364Application Date: 2017-11-17
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Publication No.: US11738508B2Publication Date: 2023-08-29
- Inventor: Sterling Chaffins , Kevin P DeKam , Kristopher J Erickson , Cory J Ruud , Jami Ryan Barone , Ruhua Cai , Anthony J Galvan
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2017/062338 2017.11.17
- International Announcement: WO2019/099030A 2019.05.23
- Date entered country: 2020-04-15
- Main IPC: B29C64/165
- IPC: B29C64/165 ; C08K3/08 ; C08L77/02 ; B33Y10/00 ; B33Y70/00 ; C08K3/04

Abstract:
In an example, a composition for three-dimensional (3D) printing includes a polymer build material and a non-conductive fusing agent dispensable onto the polymer build material to form a polymer-fusing agent composite portion when heated to a sintering temperature, a conductive agent dispensable onto on the polymer build material to form a polymer-conductive agent composite portion when heated at least to the sintering temperature, the conductive agent comprising: at least one conductive particulate present in an amount of from about 10% to about 60% of a total weight of the conductive agent; at least one co-solvent present in an amount of from about 10% to about 50% of a total weight of the conductive agent; and an additive present in an amount of from about 0% to about 10% of a total weight of the conductive agent.
Public/Granted literature
- US20200269501A1 THREE-DIMENSIONAL PRINTING Public/Granted day:2020-08-27
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