- Patent Title: Flexible pressure sensor array and method for fabricating the same
-
Application No.: US17302983Application Date: 2021-05-18
-
Publication No.: US11740143B2Publication Date: 2023-08-29
- Inventor: Li Fu , Tao Xu , Yam Chong
- Applicant: Nano and Advanced Materials Institute Limited
- Applicant Address: CN Hong Kong
- Assignee: Nano and Advanced Materials Institute Limited
- Current Assignee: Nano and Advanced Materials Institute Limited
- Current Assignee Address: CN Hong Kong
- Agency: S&F/WEHRW
- Main IPC: G01L1/18
- IPC: G01L1/18 ; D06P5/30

Abstract:
The present disclosure provides a flexible pressure sensor array and method for fabricating the same. The pressure sensor array comprises a pressure-sensing substrate, top electrodes and bottom electrodes. The pressure-sensing substrate comprises a piezoresistive material, a fabric and pressure-sensing columns. The top electrodes and the bottom electrodes are attached to the pressure-sensing columns. The pressure sensor array is ultra-flexible and conforms to 3-dimensional surface for pressure monitoring.
Public/Granted literature
- US20210372866A1 FLEXIBLE PRESSURE SENSOR ARRAY AND METHOD FOR FABRCIATING THE SAME Public/Granted day:2021-12-02
Information query