An electronic component module includes a board, an electronic component, a sealing portion, a metal layer, and a magnetic layer. The board has a first main surface. The electronic component is provided on a first main surface of the board. The sealing portion seals the electronic component. The metal layer covers the sealing portion. The magnetic layer is provided between the sealing portion and the metal layer. The magnetic layer has a magnetic main body and a first cover sheet. The first cover sheet is provided between the magnetic main body and the metal layer. The first cover sheet has a first main surface and a second main surface. The first main surface faces the magnetic main body. The second main surface faces the metal layer. The second outer peripheral end of the second main surface is located inside the first outer peripheral end of the first main surface.