- Patent Title: Photosensor comprising a first circuit board within a housing having a through hole with a cable for connecting a second circuit board and method of manufacturing the same
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Application No.: US17432101Application Date: 2020-03-10
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Publication No.: US11744025B2Publication Date: 2023-08-29
- Inventor: Shunya Takahashi , Hirotaka Nakashima , Jumpei Nakamura , Tomonari Kawakami
- Applicant: OMRON Corporation
- Applicant Address: JP Kyoto
- Assignee: OMRON Corporation
- Current Assignee: OMRON Corporation
- Current Assignee Address: JP Kyoto
- Agency: JCIPRNET
- Priority: JP 19048468 2019.03.15
- International Application: PCT/JP2020/010316 2020.03.10
- International Announcement: WO2020/189416A 2020.09.24
- Date entered country: 2021-08-19
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K5/00 ; G01J1/42
Abstract:
Provided is a photosensor in which a cable can be easily mounted on a circuit board. A photosensor is provided with: a housing; a cable; a first circuit board; and a second circuit board. A through-hole is formed in the housing. The cable is inserted into the through-hole. The first circuit board and the second circuit board are accommodated in the housing. The first circuit board is provided with a first connector. The second circuit board has a first portion and a second portion. The cable is soldered to the first portion. The second portion is provided with a second connector. The second connector is inserted into the first connector. The second circuit board connects the cable and the first circuit board.
Public/Granted literature
- US20220201875A1 PHOTOSENSOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-06-23
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