Invention Grant
- Patent Title: Additive manufacturing of metals
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Application No.: US16606898Application Date: 2018-04-30
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Publication No.: US11745266B2Publication Date: 2023-09-05
- Inventor: Seongsik Chang , Krzysztof Nauka
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: SHOOK, HARDY & BACON L.L.P.
- International Application: PCT/US2018/030175 2018.04.30
- International Announcement: WO2019/212481A 2019.11.07
- Date entered country: 2019-10-21
- Main IPC: B22F10/28
- IPC: B22F10/28 ; B33Y10/00 ; B33Y70/00 ; B33Y80/00 ; B22F12/41 ; B22F10/36 ; B22F12/45

Abstract:
An example method for additive manufacturing of metals includes spreading a build material including a metal in a sequence of layers. Each layer has a respective thickness, a respective sequence position, and a respective exposed surface to receive energy from a flood energy source prior to spreading of a subsequent layer. Each respective exposed surface has a surface area of at least 5 square centimeters (cm2). Layer-by-layer, the exposed surface of each layer is exposed to the radiated energy from the flood energy source. The energy is radiated at an intensity profile and a fluence sufficient to cause a consolidating transformation of the build material in the exposed layer.
Public/Granted literature
- US20210362237A1 ADDITIVE MANUFACTURING OF METALS Public/Granted day:2021-11-25
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