- 专利标题: Wireless power of in-mold electronics and the application within a vehicle
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申请号: US16821568申请日: 2020-03-17
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公开(公告)号: US11751337B2公开(公告)日: 2023-09-05
- 发明人: Alex W. Baker , Zainab I. Ali
- 申请人: Honda Motor Co., Ltd.
- 申请人地址: JP Tokyo
- 专利权人: HONDA MOTOR CO., LTD.
- 当前专利权人: HONDA MOTOR CO., LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: RANKIN, HILL & CLARK LLP
- 主分类号: H05K3/28
- IPC分类号: H05K3/28 ; H02J50/12 ; F21S43/14 ; H05K1/16 ; H05K1/18 ; B29C45/14 ; B29L31/34
摘要:
A functional vehicle component and related methods include a transmitter coil and a molded part. The molded part includes a first thermoformed film, a molded polymeric structural layer arranged under the film, a printed electronic circuit arranged under the film and adjacent the structural layer, an optional second thermoformed film, and graphics on the first film. The electronic circuit includes a receiver coil, conductive traces, and electronic elements. The first film is arranged to cover the polymeric structural layer and the electronic circuit to thereby define an exposed surface of the molded part. The first film and/or the graphics camouflages the circuit. The transmitter coil is connected to an external power source, and is arranged on the molded part such that the receiver coil is inductively coupled to the transmitter coil so as to wirelessly power the electronic elements of the circuit.
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