- Patent Title: Hybrid thin film permeation barrier and method of making the same
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Application No.: US15787117Application Date: 2017-10-18
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Publication No.: US11751426B2Publication Date: 2023-09-05
- Inventor: Siddharth Harikrishna Mohan , William E. Quinn , Arpit Patel , James Robert Kantor
- Applicant: Universal Display Corporation
- Applicant Address: US NJ Ewing
- Assignee: Universal Display Corporation
- Current Assignee: Universal Display Corporation
- Current Assignee Address: US NJ Ewing
- Agency: BUTZEL LONG
- Main IPC: H10K50/844
- IPC: H10K50/844 ; H10K71/00 ; H10K77/10 ; H10K102/00

Abstract:
A hybrid permeation barrier having two complementary layers is disclosed. The barrier includes a first layer with a relatively high stress-thickness in the range of −1000 MPa-μm to −200 MPa-μm and a second layer with a relatively low stress-thickness in the range −150 MPa-μm to 300 MPa-μm. The second layer compensates for the stress caused by the first, thereby allowing for a barrier that provides good permeation without causing failure of the device due to delamination.
Public/Granted literature
- US20180108865A1 HYBRID THIN FILM PERMEATION BARRIER AND METHOD OF MAKING THE SAME Public/Granted day:2018-04-19
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