Invention Grant
- Patent Title: Microfluidic devices and methods for manufacturing microfluidic devices
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Application No.: US17049676Application Date: 2019-04-23
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Publication No.: US11752500B2Publication Date: 2023-09-12
- Inventor: Ye Fang , Jin Su Kim , Aize Li
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: CORNING INCORPORATED
- Current Assignee: CORNING INCORPORATED
- Current Assignee Address: US NY Corning
- International Application: PCT/US2019/028633 2019.04.23
- International Announcement: WO2019/209776A 2019.10.31
- Date entered country: 2020-10-22
- Main IPC: B01L3/00
- IPC: B01L3/00

Abstract:
A method for manufacturing a microfluidic device (100) includes depositing a bonding layer (106) on a surface of a second glass layer (104a) of a glass substrate having a first glass layer (102) and the second glass layer (104a) fused to the first glass layer (102), such that a masked region of the surface is covered by the bonding layer, and an exposed region of the surface is uncovered by the bonding layer; removing a portion of the second glass layer corresponding to the exposed region of the surface to form a flow channel (112) in the glass substrate; and bonding a cover (108) to the glass substrate with the bonding layer (106).
Public/Granted literature
- US20210069710A1 MICROFLUIDIC DEVICES AND METHODS FOR MANUFACTURING MICROFLUIDIC DEVICES Public/Granted day:2021-03-11
Information query
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