- Patent Title: Lamination shaping copper powder and laminated and shaped product
-
Application No.: US16631832Application Date: 2017-07-18
-
Publication No.: US11752556B2Publication Date: 2023-09-12
- Inventor: Yuji Sugitani , Yoshito Nishizawa , Takeshi Maruyama , Hiroaki Okubo
- Applicant: FUKUDA METAL FOIL & POWDER CO., LTD. , TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING
- Applicant Address: JP Kyoto
- Assignee: FUKUDA METAL FOIL & POWDER CO., LTD.,TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING
- Current Assignee: FUKUDA METAL FOIL & POWDER CO., LTD.,TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING
- Current Assignee Address: JP Kyoto; JP Tokyo
- Agency: Ladas & Parry LLP
- International Application: PCT/JP2017/026000 2017.07.18
- International Announcement: WO2019/016874A 2019.01.24
- Date entered country: 2020-01-16
- Main IPC: B22F1/00
- IPC: B22F1/00 ; B22F10/28 ; B33Y70/00 ; B33Y80/00

Abstract:
This invention provides a copper powder to which tin (Sn) is added such that a high-density laminated and shaped product can be obtained by a laminating and shaping method using a fiber laser as a heat source by appropriately reducing the electrical conductivity of copper, so a laminated and shaped product having a high density and a high electrical conductivity can be obtained. That is, this invention provides a copper powder for lamination shaping in which a tin element is added to pure copper. Desirably, the copper powder contains 0.5 wt % or more of the tin element. More desirably, the copper powder contains 5.0 wt % or more of the tin element. When the product has an electrical conductivity sufficient as a copper product, the copper powder desirably contains 6.0 wt % or less of the tin element. Furthermore, no element other than the tin element is desirably added to the copper powder.
Public/Granted literature
- US20200147682A1 LAMINATION SHAPING COPPER POWDER AND LAMINATED AND SHAPED PRODUCT Public/Granted day:2020-05-14
Information query