Invention Grant
- Patent Title: Multi-purpose heat sink, method of manufacturing the same, board card, and multi-purpose heat sink platform
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Application No.: US16714678Application Date: 2019-12-13
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Publication No.: US11752581B2Publication Date: 2023-09-12
- Inventor: Chongxing Zhu , Huijun Lan , Kun He , Kai Ye , Deheng Chen , Shuai Chen
- Applicant: Cambricon Technologies Corporation Limited
- Applicant Address: CN Beijing
- Assignee: CAMBRICON TECHNOLOGIES CORPORATION LIMITED
- Current Assignee: CAMBRICON TECHNOLOGIES CORPORATION LIMITED
- Current Assignee Address: CN Beijing
- Agency: Getech Law LLC
- Agent Jun Ye
- Priority: CN 1910471371.0 2019.05.31
- Main IPC: F28F7/00
- IPC: F28F7/00 ; B23P15/26 ; F28F3/12 ; F28D15/02 ; F28D21/00
Abstract:
The present disclosure provides a multi-purpose heat sink, a method of manufacturing the same, a board card, and a multi-purpose heat sink platform, where the multi-purpose heat sink is composed of a bracket (310) and heat dissipation components. The cost of the multi-purpose heat sink in the present disclosure is low.
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