Invention Grant
- Patent Title: Substrate handling device and processing chamber
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Application No.: US17835921Application Date: 2022-06-08
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Publication No.: US11752638B2Publication Date: 2023-09-12
- Inventor: You-Hua Chou , Kuo-Sheng Chuang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- The original application number of the division: US15601079 2017.05.22
- Main IPC: B25J11/00
- IPC: B25J11/00 ; H01L21/687 ; H01L21/677 ; B25J15/00

Abstract:
A substrate handling device includes a substrate reception area defined by an edge. The substrate reception area includes a planar surface, wherein the edge extends upward from the planar surface. The substrate reception area further includes a plurality of contact structures extending upwards from the planar surface, wherein a first contact structure of the plurality of contact structures directly contacts a side surface of the edge, a second contact structure of the plurality of contact structures separated from the edge, a shape of the first contact structure is different from a shape of the second contact structure. The substrate reception area and the planar surface include a first material. Each contact structure of the plurality of contact structures includes a second material different from the first material, and the second material has a hardness aligned to a hardness of a substrate material.
Public/Granted literature
- US20220331976A1 SUBSTRATE HANDLING DEVICE AND PROCESSING CHAMBER Public/Granted day:2022-10-20
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