Invention Grant
- Patent Title: Patterning paste
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Application No.: US16766432Application Date: 2018-11-20
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Publication No.: US11753561B2Publication Date: 2023-09-12
- Inventor: Paul F. Cheetham , Shawn R. DeBerry
- Applicant: PPG Industries Ohio, Inc.
- Applicant Address: US OH Cleveland
- Assignee: PPG Industries Ohio, Inc.
- Current Assignee: PPG Industries Ohio, Inc.
- Current Assignee Address: US OH Cleveland
- Agent Krisanne Shideler
- International Application: PCT/US2018/061984 2018.11.20
- International Announcement: WO2019/104022A 2019.05.31
- Date entered country: 2020-05-22
- Main IPC: C09D11/52
- IPC: C09D11/52 ; C09D11/037 ; C23F1/02 ; C23F1/10 ; G06F3/044 ; H05K1/09 ; H05K3/06 ; H01Q1/38

Abstract:
A patterning paste is disclosed for patterning metal nanowires, the patterning paste including a complexing agent containing guanidine thiocyanate. A method of selectively patterning a substrate having metal nanowires includes: providing a substrate having a surface bearing metal nanowires; and selectively applying the patterning paste to the substrate such that the metal nanowires are selectively cut into a pattern. A consumer electronic product includes: a substrate having a surface bearing metal nanowires. The metal nanowires of the substrate are selectively patterned by applying the patterning paste to the substrate such that the metal nanowires are selectively cut into the pattern.
Public/Granted literature
- US20210032489A1 Patterning Paste Public/Granted day:2021-02-04
Information query
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