Invention Grant
- Patent Title: Methods and apparatus for forming node to panel joints
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Application No.: US17378390Application Date: 2021-07-16
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Publication No.: US11754107B2Publication Date: 2023-09-12
- Inventor: William David Kreig , Chukwubuikem Marcel Okoli , David Brian TenHouten , Antonio Bernerd Martinez , Kevin Robert Czinger , Broc William TenHouten
- Applicant: DIVERGENT TECHNOLOGIES, INC.
- Applicant Address: US CA Los Angeles
- Assignee: DIVERGENT TECHNOLOGIES INC.
- Current Assignee: DIVERGENT TECHNOLOGIES INC.
- Current Assignee Address: US CA Los Angeles
- Agency: ARENTFOX SCHIFF LLP
- Main IPC: F16B11/00
- IPC: F16B11/00 ; F16B5/12

Abstract:
A node to panel interface structure for use in a transport structure such as a vehicle is disclosed. In an aspect, the node includes a base, first and second sides protruding from the base to form a recess for receiving a panel, ports for adhesive injection and/or vacuum generation, one or more adhesive regions disposed on a surface of each side adjacent the panel, and at least one channel coupled between the first and second ports and configured to fill the adhesive regions with an adhesive, the adhesive being cured to form a node-panel interface. The node may be additively manufactured. In an exemplary embodiment, the node may use sealant features for including sealants that border and define the adhesive regions, and that may hermetically seal the region before and after adhesive injection. In another embodiment, the node may include isolation features for including isolators for inhibiting galvanic corrosion. In another aspect, adhesive may be filled serially on the adhesive regions on the first side and then on the adhesive regions on the second side. Adhesive may alternatively may be filled in parallel, or concurrently, on the adhesive regions of both sides.
Information query