Invention Grant
- Patent Title: Bonding part, multiple-plate clutch device provided with said bonding part, and manufacturing method of bonding part
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Application No.: US17767207Application Date: 2019-11-05
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Publication No.: US11754128B2Publication Date: 2023-09-12
- Inventor: Akihiro Yamashita , Kyohei Morimoto , Tatsuki Hosoda , Xingyu Ren
- Applicant: Kabushiki Kaisha F.C.C.
- Applicant Address: JP Hamamatsu
- Assignee: Kabushiki Kaisha F.C.C.
- Current Assignee: Kabushiki Kaisha F.C.C.
- Current Assignee Address: JP Shizuoka
- Agency: Rankin, Hill & Clark LLP
- Priority: JP 19194069 2019.10.25
- International Application: PCT/JP2019/043296 2019.11.05
- International Announcement: WO2021/079533A 2021.04.29
- Date entered country: 2022-04-07
- Main IPC: F16D13/64
- IPC: F16D13/64 ; F16D69/04 ; B23K26/364 ; F16D13/52

Abstract:
Provided are a joint component formed with fine recessed portions, a multiplate clutch device including the joint component, and a joint component manufacturing method. At the joint component, many fine recessed portions are formed at a joint surface joined to a joint object. The joint surface is formed in a circular ring shape along a peripheral direction of the base body, and is formed with a flatness of equal to or less than 0.15 mm. The fine recessed portions are formed at the joint surface such that adjacent ones of the fine recessed portions do not overlap with each other and a formation density per unit area at the joint surface is uniform. The fine recessed portions are formed as laser processing marks formed at the base body by irradiation with laser light.
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