Invention Grant
- Patent Title: Baffles for thermal transfer devices
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Application No.: US17515908Application Date: 2021-11-01
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Publication No.: US11754318B2Publication Date: 2023-09-12
- Inventor: Bruce Hotton , Amin Monfared , Lee Chambers , Babak Bagheri , Arash Jafari , Tim Shellenberger
- Applicant: Rheem Manufacturing Company
- Applicant Address: US GA Atlanta
- Assignee: Rheem Manufacturing Company
- Current Assignee: Rheem Manufacturing Company
- Current Assignee Address: US GA Atlanta
- Agency: Eversheds Sutherland (US) LLP
- Main IPC: F02B75/00
- IPC: F02B75/00 ; F24H9/00 ; F22B37/06 ; F28D7/16 ; F28F9/22 ; F28F9/24

Abstract:
A baffle for a thermal transfer device can include a body having a multiple first apertures that traverse therethrough, where each first aperture has a first outer perimeter that includes a first base shape and at least one first protrusion extending from the first base shape. Each of the first apertures is configured to receive a tube. The first base shape of each first aperture has a first shape and a first size that is configured to be substantially the same as the first shape and the first size of an end of a tube.
Public/Granted literature
- US20220057110A1 Baffles For Thermal Transfer Devices Public/Granted day:2022-02-24
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