Invention Grant
- Patent Title: Pressure measuring material and method for manufacturing pressure measuring material
-
Application No.: US17373812Application Date: 2021-07-13
-
Publication No.: US11754453B2Publication Date: 2023-09-12
- Inventor: Masahiro Hatta , Hiroshi Kawakami
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JP 19006244 2019.01.17
- Main IPC: G01L1/24
- IPC: G01L1/24

Abstract:
Provided is a pressure measuring material having a substrate and a pressure-sensitive layer, wherein the pressure-sensitive layer contains a polymer matrix containing a polymer compound having a molecular weight of 1,000 or more, and microcapsules encapsulating an electron-donating dye precursor and a solvent, and an electron-accepting compound. Also provided is a method for manufacturing the pressure measuring material.
Public/Granted literature
- US20210341345A1 PRESSURE MEASURING MATERIAL AND METHOD FOR MANUFACTURING PRESSURE MEASURING MATERIAL Public/Granted day:2021-11-04
Information query