Invention Grant
- Patent Title: Glass core, multilayer circuit board, and method of manufacturing glass core
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Application No.: US15930696Application Date: 2020-05-13
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Publication No.: US11756846B2Publication Date: 2023-09-12
- Inventor: Tetsuyuki Tsuchida
- Applicant: TOPPAN PRINTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP 17229922 2017.11.30
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/11 ; H01L23/15 ; H05K3/46 ; H05K1/18

Abstract:
A glass core, a multilayer circuit board, and a method of manufacturing a glass core that appropriately form copper wiring, and suppresses crack and the like, a glass core includes: a glass plate; a first metal layer provided on the glass plate; a first electrolytic copper plating layer provided on the first metal layer; a dielectric layer provided above the first electrolytic copper plating layer; a second metal layer provided on the dielectric layer; an electroless nickel plating layer provided on the second metal layer and having a phosphorus content of less than 5 mass %; and a second electrolytic copper plating layer provided on the electroless nickel plating layer.
Public/Granted literature
- US20200273763A1 GLASS CORE, MULTILAYER CIRCUIT BOARD, AND METHOD OF MANUFACTURING GLASS CORE Public/Granted day:2020-08-27
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